
Semiconductor manufacturing equipmentPure Ozone Generator (High-concentration Ozone Gas Generator)
It is an unit that can safely and continuously produce ozone gas at the concentration level of nearly 100%.
Product Features



Meiden Pure Ozone Generator is a unit that liquefies and stores the ozone gas and supplies high-purity ozone gas continuously. Because of high purity ozone level, it can be used as an oxygen radical generation source for a semiconductor process. For safety, the unit has sufficient safety measures.
Furthermore, this unit was jointly developed with the National Institute of Advanced Industrial Science and Technology in Japan.
- Explosion-proof design for emergencies
- During the power outage or abnormal situation, it can control temperature and pressure by a fail safe system.
- Compliant with international safety standards SEMI-S2, UL, NFPA, CE, etc.
- For safety level against gas leak it was proven by a tracer gas test by a third party cerfifying body.
Applications and Solutions
Removal of a stamper in nanoimprint (use of the added gas treatment method)
- Complete removal of the resist attached to the stamper

Surface modification of the film (use of the added gas treatment method)
- Improvement of the wetting property by the surface modification of the film

Specifications
For specifications and outline drawing, see the catalog.
Applicable fields
Field | Category | Applicable technology | Expectation effect |
---|---|---|---|
Environment | Water treatment | Pure ozone treatment method | Disinfection, deodorization, and decolorization |
Medical treatment | Medical equipment | Pure ozone treatment method | Sterilization and pharmaceutical (organic synthesis) |
Film | FPD related | Added gas treatment method | Surface modification and coating of film for touch panels, etc. |
Semiconductor mounting related | Surface modification and coating of film for FPC, etc. | ||
Food related | Surface modification of packing material | ||
Battery related | Surface modification of film for solar cells, etc. | ||
Materials | Member | Pure ozone treatment method | Carbon nanotube modification and spherical silicon oxidation |
Battery | Electrodes | Added gas treatment method | Electrode member modification |
Semiconductor | Film forming process | •Pure ozone treatment method •UV ozone CVD process method •Added gas treatment method |
Oxidation, CVD, insulating film modification, ashing, and dry cleaning |
Lithography | Photomask modification, precision part cleaning, and EUVL | ||
Advanced system | MEMS | •Pure ozone treatment method •Added gas treatment method |
Ashing and dry cleaning |
Nanoimprint | Dry cleaning of stampers | ||
Micromachining related | High temperature superconductor film and molecular beam epitaxy (MBE) | ||
Printed electronics | Surface modification and coating before and after the printing step |
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