Semiconductor manufacturing equipmentPure Ozone Generator (High-concentration Ozone Gas Generator)
It is an unit that can safely and continuously produce ozone gas at the concentration level of nearly 100%.
Meiden Pure Ozone Generator is a unit that liquefies and stores the ozone gas and supplies high-purity ozone gas continuously. Because of high purity ozone level, it can be used as an oxygen radical generation source for a semiconductor process. For safety, the unit has sufficient safety measures.
Furthermore, this unit was jointly developed with the National Institute of Advanced Industrial Science and Technology in Japan.
- Explosion-proof design for emergencies
- During the power outage or abnormal situation, it can control temperature and pressure by a fail safe system.
- Compliant with international safety standards SEMI-S2, UL, NFPA, CE, etc.
- For safety level against gas leak it was proven by a tracer gas test by a third party cerfifying body.
Applications and Solutions
Removal of a stamper in nanoimprint (use of the added gas treatment method)
- Complete removal of the resist attached to the stamper
Surface modification of the film (use of the added gas treatment method)
- Improvement of the wetting property by the surface modification of the film
For specifications and outline drawing, see the catalog.
|Field||Category||Applicable technology||Expectation effect|
|Environment||Water treatment||Pure ozone treatment method||Disinfection, deodorization, and decolorization|
|Medical treatment||Medical equipment||Pure ozone treatment method||Sterilization and pharmaceutical (organic synthesis)|
|Film||FPD related||Added gas treatment method||Surface modification and coating of film for touch panels, etc.|
|Semiconductor mounting related||Surface modification and coating of film for FPC, etc.|
|Food related||Surface modification of packing material|
|Battery related||Surface modification of film for solar cells, etc.|
|Materials||Member||Pure ozone treatment method||Carbon nanotube modification and spherical silicon oxidation|
|Battery||Electrodes||Added gas treatment method||Electrode member modification|
|Semiconductor||Film forming process||•Pure ozone treatment method
•UV ozone CVD process method
•Added gas treatment method
|Oxidation, CVD, insulating film modification, ashing, and dry cleaning|
|Lithography||Photomask modification, precision part cleaning, and EUVL|
|Advanced system||MEMS||•Pure ozone treatment method
•Added gas treatment method
|Ashing and dry cleaning|
|Nanoimprint||Dry cleaning of stampers|
|Micromachining related||High temperature superconductor film and molecular beam epitaxy (MBE)|
|Printed electronics||Surface modification and coating before and after the printing step|
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