
Semiconductor manufacturing equipmentPure Ozonated Water Generator (Ultra-High Concentration / High-Purity)
Applying pure ozone gas (≒100%) produced by proprietary technology, Meiden has developed the world's top-class highly concentrated pure ozonated water based on a design concept for safe handling at normal pressure.
Product Features
- Ultra-High Concentration
Stably produces pure ozonated water with an ultra-high concentration of 400 mg/L or more using pure ozone gas (≒100%) and reduced pressure generation method (patent pending) using a unique manufacturing method.(Achieving an instantaneous maximumu concentration of 450mg/L※1)
※1 Maximum concentration that can be generated only under certain conditions. - High-Purity
Achieves high purity with ozone gas that does not contain impurities such as gases such as oxygen or heavy metals. - The reduced pressure generation method enables the ozonated water to maintain its concentration for a long period of time without rapid reduction even when the ozonated water is used under atmospheric pressure.
- OUR※2 Process Technology
Invention of powerful oxidation promotion method that can be achieved using pure ozonated water, expected to be used for removing highly ion-implanted resists in semiconductor processes.
※2 Ozonated water Used Radical generation - Safety Measures
・This device generates ozone gas and ozone water under reduced pressure.
・This is a safe device design that follows the reliable design philosophy cultivated by POG and does not cause dangerous reactions even at high purity, low temperature, and low pressure. - Standards Certification
・International safety standards※3 (SEMI-S2, UL, NFPA, CE, etc.)
※3 Scheduled to be acquired from FY2024 - Quality Assurance
・Performance is verified and operation is checked at the customer's site before delivery of the equipment to the customer.
・Safety is demonstrated through a trace gas test by a third-party certification body.



Pure Ozonated Water

Long-Lasting Concentration

Applications and Solutions
1.Semiconductor Wafer Removal of Resist Implanted with High Concentraion of Ions

2.Surface Modification of Carbon Resin and Other Carbon Fibers

3.Degreasing and Cleaning Industrial Products

4.Property Modification of Pigments and Other Powder Paint Materials

Product Specifications
Concentration | 0~400mg/L |
---|---|
Water temperature | 5~20℃ |
Flow rate | 0.3~1.0L/min |
Purity | Impurity concentration below ppt |
Ozonated water generation method | Reduced Pressure Generation Method |
Operation method | Batch type (continuous type to be released in FY2024) |
Dimensions (excluding protrusions) |
Low capacity type:W1,900×D1,000×H1,980mm High capacity type:W2,200×D1,000×H1,980mm |
Mass | Low capacity type:1,345kg High capacity type:1,501kg |
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